Bonding by Self-Propagating Reaction

Bonding by Self-Propagating Reaction represents a highly promising approach for the joining of dissimilar materials in such fields as microelectronics, infrared sensors, micro-electro-mechanical systems (MEMS), aerospace and nuclear industries, and surface engineering for chemical, mechanical and mi...

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Bibliographic Details
Main Author: Fisher, David
Format: eBook
Language:English
Published: Millersville, PA Materials Research Forum LLC, 2019.
Series:Materials Research Foundations Ser.
Subjects:
Online Access:https://www.lib.tsu.ru/mminfo/2023/EBSCO/2047345.pdf
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245 1 0 |a Bonding by Self-Propagating Reaction  |h [electronic resource]. 
260 |a Millersville, PA  |b Materials Research Forum LLC,  |c 2019. 
300 |a 1 online resource (146 p.). 
490 1 |a Materials Research Foundations Ser. ;  |v v.45 
500 |a Description based upon print version of record. 
505 0 |a Intro; Table of Contents; Bonding by Self-Propagating Reaction; Thermite-Type Bonding; Al|Co3O4; Al|CuO; Al|Fe2O3; Al|MoO3; Non-Thermite Type Bonding; Al|Au; Al|Co; Al|Ni; Al|Pd; Al|Pt; Al|Ru; Al|Ti; Al|Zr; Ni|Ti; Ni|Zr; Miscellaneous; Metal|RE; Ti|B; Zr|B; Nb|Si; Ni|Si; Ti|Si; Rh|Si; Si|NaClO4; References; Keyword Index 
520 |a Bonding by Self-Propagating Reaction represents a highly promising approach for the joining of dissimilar materials in such fields as microelectronics, infrared sensors, micro-electro-mechanical systems (MEMS), aerospace and nuclear industries, and surface engineering for chemical, mechanical and microsystems applications. Keywords: Microsystems, Sensors, Actuators, High-Temperature Synthesis, Multilayer Films, Bilayer Thickness, Magnetron Sputtering, Thermite-Type Bonding, Silicon Wafers, Intermetallics, Metalloids, Metallic Glasses, Ceramics, Metallized Ceramics, Nanofoils, Nanocomposite Foi. 
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