Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections

Bibliographic Details
Published in:	Springer e-books
Main Author:	Greig, William J.
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Boston, MA : Springer Science+Business Media LLC, 2007.
Subjects:	electronics engineering Engineering design Optical materials Systems engineering Engineering Circuits and Systems Electronics and Microelectronics, Instrumentation Engineering Design Optical and Electronic Materials
Online Access:	http://dx.doi.org/10.1007/0-387-33913-2 Перейти в каталог НБ ТГУ

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