Copper Wire Bonding
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...
| Published in: | Springer eBooks |
|---|---|
| Main Authors: | , , , |
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
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| Subjects: | |
| Online Access: | http://dx.doi.org/10.1007/978-1-4614-5761-9 Перейти в каталог НБ ТГУ |
Table of Contents:
- Copper Wire Bonding
- Bonding Process
- Bonding Metallurgies
- Wire Bond Evaluation
- Thermal Reliability Tests
- Humidity and Electromigration Tests
- Wire Bond Pads
- Concerns and Solutions
- Recommendations
- Appendix A: Reliability Data
- Appendix B: Patents on Copper Wire Bonding.