Modal testing circuit board assembly of an electronic apparatus by laser vibrometry

The operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of...

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Bibliographic Details
Published in:IOP Conference Series: Materials Science and Engineering Vol. 156. P. 012005 (1-7)
Other Authors: Krasnoveikin, Vladimir A., Druzhinin, N. V., Kolubaev, Evgeniy A., Derusova, D. A., Smolin, Igor Yu
Format: Article
Language:English
Subjects:
Online Access:http://vital.lib.tsu.ru/vital/access/manager/Repository/vtls:000623266
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245 1 0 |a Modal testing circuit board assembly of an electronic apparatus by laser vibrometry  |c V. A. Krasnoveikin, I. Y. Smolin, N. V. Druzhinin [et.al.] 
504 |a Библиогр.: 11 назв. 
520 3 |a The operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of a circuit board assembly in order to identify its vulnerable spots and to find solutions to protect the assembly from external vibroacoustic loads. A broadband periodic chirp signal was used to excite vibration, which enabled a rapid generation of results. The paper provides data on eigenfrequencies, vibration velocity fields, and vibration displacement profiles. Frequency ranges have been determined in which eigenfrequencies with the highest vibration amplification lie. The obtained data can be used to develop a quality control technique for printed circuit boards and to optimize their construction as early as the design stage. 
653 |a лазерная виброметрия 
653 |a печатные платы 
653 |a виброакустические нагрузки 
655 4 |a статьи в журналах  |9 879358 
700 1 |a Krasnoveikin, Vladimir A.  |9 104806 
700 1 |a Druzhinin, N. V.  |9 480939 
700 1 |a Kolubaev, Evgeniy A.  |9 101533 
700 1 |a Derusova, D. A.  |9 480940 
700 1 |a Smolin, Igor Yu.  |9 103820 
773 0 |t IOP Conference Series: Materials Science and Engineering  |d 2016  |g Vol. 156. P. 012005 (1-7)  |x 1757-8981 
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