Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge res...
| Published in: | Springer eBooks |
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| Main Authors: | , |
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Cham :
Springer International Publishing : Imprint: Springer,
2014.
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| Subjects: | |
| Online Access: | http://dx.doi.org/10.1007/978-3-319-02378-6 Перейти в каталог НБ ТГУ |