Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...
| Опубликовано в: : | Springer eBooks |
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| Главные авторы: | , , , |
| Соавтор: | |
| Формат: | Электронная книга |
| Язык: | English |
| Публикация: |
Boston, MA :
Springer US : Imprint: Springer,
2015.
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| Предметы: | |
| Online-ссылка: | http://dx.doi.org/10.1007/978-1-4614-9266-5 Перейти в каталог НБ ТГУ |