Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Although several groups have already demonstrated functional Si channel devices with aggressively scaled Equivalent Oxide Thickness (EOT) down to 5Å, a 10 ye...
Published in: | Springer eBooks |
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Main Authors: | , , |
Corporate Author: | |
Format: | eBook |
Language: | English |
Published: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2014.
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Series: | Springer Series in Advanced Microelectronics,
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Subjects: | |
Online Access: | http://dx.doi.org/10.1007/978-94-007-7663-0 Перейти в каталог НБ ТГУ |
Table of Contents:
- 1 Introduction
- 2 Degradation mechanisms
- 3 Techniques and devices
- 4 Negative Bias Temperature Instability in (Si)Ge pMOSFETs
- 5 Negative Bias Temperature Instability in nanoscale devices
- 6 Channel Hot Carriers and other reliability mechanisms
- 7 Conclusions and perspectives.