Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications

Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Although several groups have already demonstrated functional Si channel devices with aggressively scaled Equivalent Oxide Thickness (EOT) down to 5Å, a 10 ye...

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Bibliographic Details
Published in:Springer eBooks
Main Authors: Franco, Jacopo (Author), Kaczer, Ben (Author), Groeseneken, Guido (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
Series:Springer Series in Advanced Microelectronics,
Subjects:
Online Access:http://dx.doi.org/10.1007/978-94-007-7663-0
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Table of Contents:
  • 1 Introduction
  • 2 Degradation mechanisms
  • 3 Techniques and devices
  • 4 Negative Bias Temperature Instability in (Si)Ge pMOSFETs
  • 5 Negative Bias Temperature Instability in nanoscale devices
  • 6 Channel Hot Carriers and other reliability mechanisms
  • 7 Conclusions and perspectives.