High-spatial resolution measurements with a GaAs:Cr sensor using the charge integrating MÖNCH detector with a pixel pitch of 25 μm
The aim of this project is to determine the imaging capabilities of a 25 μ m pixel pitch GaAs:Cr sensor of 500 μm thickness bump-bonded to the charge integrating MÖNCH 03 readout chip (also called GaAs-MÖNCH assembly) and to assess the possibility to improve the spatial resolution by applying a po...
Published in: | Journal of instrumentation : electronic journal Vol. 17, № 4. P. P04007 (1-17) |
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Other Authors: | , , , , , , , , , , , , , , , , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | http://vital.lib.tsu.ru/vital/access/manager/Repository/koha:000997248 Перейти в каталог НБ ТГУ |