High-spatial resolution measurements with a GaAs:Cr sensor using the charge integrating MÖNCH detector with a pixel pitch of 25 μm

The aim of this project is to determine the imaging capabilities of a 25 μ m pixel pitch GaAs:Cr sensor of 500 μm thickness bump-bonded to the charge integrating MÖNCH 03 readout chip (also called GaAs-MÖNCH assembly) and to assess the possibility to improve the spatial resolution by applying a po...

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Bibliographic Details
Published in:Journal of instrumentation : electronic journal Vol. 17, № 4. P. P04007 (1-17)
Other Authors: Chiriotti, Sabina, Barten, Rebecca, Bergamaschi, Anna, Carulla, M., Chsherbakov, Ivan, Dinapoli, Roberto, Fröjdh, Erik, Greiffenberg, Dominic, Hasanaj, Shqipe, Hinger, V., King, T., Kozlowski, Pawel, López-Cuenca, Carlos, Lozinskaya, Anastassiya D., Marone, F., Mezza, Davide, Moustakas, K., Mozzanica, Aldo, Ruder, Christian, Schmitt, Bernd, Thattil, Dhanya, Tolbanov, Oleg P., Tyazhev, Anton V., Zarubin, Andrei N., Zhang, J., Brückner, Martin
Format: Article
Language:English
Subjects:
Online Access:http://vital.lib.tsu.ru/vital/access/manager/Repository/koha:000997248
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